Electronic chip thermal conduction applications


IC chips, generally referring to all electronic components, are circuit modules that integrate a variety of electronic components on a silicon board to achieve a specific function. It is the most important part of electronic equipment, responsible for computing and storage functions. The application scope of integrated circuits covers almost all electronic equipment for military and civilian use.

Chipset (Chipset) is the core component of the motherboard. According to the arrangement position on the motherboard, it is usually divided into Northbridge chip and Southbridge chip.

With the rapid development of microelectronics technology, the size of chips is getting smaller and smaller, and the computing speed is getting faster and faster, and the heat generation is getting larger and larger, which puts forward higher requirements for the heat dissipation of the chip. Designers must use advanced heat dissipation processes and heat dissipation materials with excellent performance to effectively take away heat and ensure that the chip can operate normally within the maximum temperature it can withstand.

One of the more commonly used heat dissipation methods at present is to use a heat sink. The heat sink is installed on the chip using thermally conductive materials and tools to quickly remove the heat generated by the chip.


Because there will be many ravines or gaps between the bottom surface of the radiator and the surface of the chip, which are filled with air. Since air is a poor conductor of heat, the air gap will seriously affect the heat dissipation efficiency, greatly reducing the performance of the radiator, or even failing to function. In order to reduce the gap between the chip and the heat sink and increase the contact area, it must be filled with thermally conductive materials with good thermal conductivity, such as thermally conductive pads, thermally conductive silicone grease, thermally conductive gel, phase change materials, etc. As shown in the figure, the heat emitted by the chip is transferred to the radiator through the thermal conductive material, and then the high-speed rotation of the fan takes most of the heat away to the surrounding air through convection (forced convection and natural convection), forcing the heat to be removed. Excluded, this creates a heat dissipation path from the chip, then through the heat sink and thermal material, to the surrounding air.

As IC chips become more and more integrated, the requirements for the heat transfer effect of thermal interface materials have also increased. Our company has developed professional thermal interface materials for IC chip heat dissipation.

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