Communication base station equipment is developing in the direction of lightweight, high power, and high integration. The heat consumption density of the system is increasing, but the volume is decreasing.

The outdoor base station casing is generally a die-cast cavity. Due to high reliability requirements, passive cooling is usually used to dissipate heat from the entire machine. At present, the heat generated by this type of equipment has exceeded 30W/L, and can reach as high as 35W/L. The heat generated is huge, which brings serious challenges to the heat dissipation of the entire machine.

In mobile communication networks, the heat generated by base stations increases, and the difficulty of temperature control is also rising. The power consumption of 5G base stations is 2.5 to 4 times that of 4G base stations, which is mainly generated by AAU and BBU during signal conversion, processing and transmission. The increase in base station power consumption means an increase in heat generation.

If the heat is not dissipated in time, the internal ambient temperature of the base station will rise. Once the rated temperature is exceeded, it will seriously affect the stability of the network and the service life of the equipment.

5G base stations are usually installed on iron frames on the roof of buildings or at high places in the wild. Therefore, reducing the size and weight is crucial to the ease of installation of the equipment. This will inevitably bring greater challenges to the heat dissipation of 5G base stations. In order to better solve the heat dissipation problem of 5G base stations, it is required to improve the heat exchange efficiency of the base stations as much as possible and reduce the thermal resistance of heat transfer in a limited space.

In addition to optimizing the heat sink design, using liquid cooling methods, new heat dissipation materials or reasonable chip layout, high thermal conductivity materials with higher thermal conductivity and lower thermal resistance are also needed to allow the heat from the heat source to be transferred to the heat dissipation case more quickly .